From Education to Innovation — Building the Future of the U.S. Semiconductor Industry

Apr 1 – 2, 2026
Renaissance Atlanta Midtown Hotel
America/New_York timezone
Championing New Approaches to Reestablishing US Dominance in Semiconductors & Microelectronics

Deterministic Integration of MoS2-Graphene Heterostructures for Future Chip-Scale 2D Electronics

Not scheduled
20m
Ball Room (Renaissance Atlanta Midtown Hotel)

Ball Room

Renaissance Atlanta Midtown Hotel

866 W Peachtree St NW, Atlanta, GA 30308
POSTER Materials & Devices - (a) Poster Session

Speaker

Mr Mustafa Ali (Prairie View A&M University)

Description

Two-dimensional (2D) van der Waals heterostructures offer a powerful materials-by-design approach for beyond-CMOS electronics, enabling atomically sharp junctions, clean interfaces, and heterogeneous integration on silicon platforms. Among these, MoS₂–graphene heterostructures combine graphene’s high conductivity and tunable work function with the semiconducting bandgap of MoS₂, providing a versatile platform for low-resistance contacts, ultrathin channels, and 2D–2D junction devices relevant to future chip technologies. Here, we report the fabrication and spectroscopic verification of a MoS₂–graphene vdW heterostructure assembled on SiO₂/Si using a viscoelastic stamping technique. This approach enables deterministic placement and alignment of exfoliated 2D layers while minimizing solvent exposure and interfacial contamination, which are critical for reproducible device integration. Optical microscopy confirms successful overlap of graphene and MoS₂ flakes. Raman spectroscopy reveals the simultaneous presence of characteristic graphene G (~1576 cm⁻¹) and 2D (~2708 cm⁻¹) bands, along with MoS₂ E12g(~377 cm⁻¹) and A1g(~402 cm⁻¹) modes, confirming few-layer MoS₂ and high-quality graphene in the heterostructure. Building on these results, we will advance MoS₂–graphene 2D–2D junctions through spectroscopic mapping, interface engineering, and correlation of Raman signatures with electrical and optoelectronic performance. This platform enables scalable integration of 2D materials for chip-scale technologies, including low-power electronics, RF contacts, photodetectors, and heterogeneous integration on Silicon.

Academic or Professional Status Undergraduate Student

Author

Mr Mustafa Ali (Prairie View A&M University)

Co-authors

Dr Anthony Hill (Prairie View A&M University) Dr Avra Bandyopadhyay (Prairie View A&M University) Mr Joseph Hong (Texas A&M University) Dr Yuxuan Lin (Texas A&M University)

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